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硅酸盐通报 ›› 2026, Vol. 45 ›› Issue (4): 1354-1367.DOI: 10.16552/j.cnki.issn1001-1625.2025.1205

• 陶瓷 • 上一篇    下一篇

玻璃粉体粒径对CaO-B2O3-La2O3/Al2O3 LTCC复合材料烧结致密化及性能的影响

吕子彬1(), 曹禹1, 何坤2, 那华1, 吕金玉1, 海韵1, 徐博1, 韩滨1, 王衍行1, 祖成奎1()   

  1. 1.中国建筑材料科学研究总院有限公司,玻璃基功能材料技术创新中心,北京 100024
    2.中建材科创新技术研究院(山东)有限公司,枣庄 277100
  • 收稿日期:2025-12-02 修订日期:2026-01-19 出版日期:2026-04-20 发布日期:2026-05-14
  • 通信作者: 祖成奎,博士,教授。E-mail:zuchengkui@cbma.com.cn
  • 作者简介:吕子彬(1998—),男,博士研究生。主要从事流延浆料的研究。E-mail:1207833925@qq.com

Influence of Particle Size of Glass Powder on Densification Behavior and Properties of CaO-B2O3-La2O3/Al2O3 LTCC Composite Material

LYU Zibin1(), CAO Yu1, HE Kun2, NA Hua1, LYU Jinyu1, HAI Yun1, XU Bo1, HAN Bin1, WANG Yanhang1, ZU Chengkui1()   

  1. 1.Glass-Based Functional Material Technology Innovation Center,China Building Materials;Academy Co. ,Ltd. ,Beijing 100024,China
    2.CNBM Technology Innovation Academy (Shandong) Co. ,Ltd. ,Zaozhuang 277100,China
  • Received:2025-12-02 Revised:2026-01-19 Published:2026-04-20 Online:2026-05-14

摘要:

在微波与高速通信应用需求的推动下,低温共烧陶瓷(LTCC)技术因在器件小型化和高频集成方面的优势而备受关注,玻璃粉体粒径是决定陶瓷基板烧结行为与性能的关键因素。本研究以CaO-B2O3-La2O3/Al2O3 LTCC复合材料为研究对象,系统研究了玻璃粉体粒径对烧结致密化和烧结基板综合性能的影响。采用X射线衍射(XRD)、热机械分析(TMA)和扫描电子显微镜(SEM)等表征方法分析了烧结基板的晶相组成和微观结构,同时利用网络分析仪评估烧结基板在不同频率下的介电性能。结果表明,玻璃粉体粒径直接影响了材料的致密化过程与析晶行为。当粒径为1.64 μm且分布集中时,生瓷带具有最低的表面粗糙度121 nm,烧结基板的孔隙率仅为5.142%,表现出最高的密度3.129 g/cm3,同时具有最大的介电常数6.681(20 GHz)和较低的介电损耗1.058×10-3(20 GHz),抗弯强度达到最大值217.946 MPa。而过细的玻璃粉体粒径则会导致流延浆料团聚与析晶提前,致密化与晶粒生长不协调,致密化下降。本研究凸显出玻璃粉体粒径对烧结行为的关键作用,为后续高频LTCC复合材料的设计提供了参考。

关键词: 玻璃粉体粒径, 复合陶瓷, LTCC, 烧结致密化, 介电性能, 烧结基板

Abstract:

Driven by the demands of microwave and high-speed communication applications, low temperature co-fired ceramic(LTCC) technology has attracted significant attention owing to their advantages in device miniaturization and high-frequency integration, where the particle size of glass powder serves as a key factor determining sintering behavior and performance of ceramic substrates. In this study, the CaO-B2O3-La2O3/Al2O3 LTCC composite materials were employed to systematically investigate the influence of particle size of glass powder on sintering densification and comprehensive material performance of sintered substrates. The crystalline phases and microstructures of the sintered substrates were characterized using X-ray diffraction (XRD), thermomechanical analysis(TMA), and scanning electron microscope(SEM), while the dielectric properties across different frequencies were evaluated with a network analyzer. The results indicate that the particle size of glass powder directly affects the densification process and crystallization behavior of the material. When the particle size of glass powder is 1.64 μm and the distribution is concentrated, the green tapes exhibit the lowest surface roughness of 121 nm. The porosity of the sintered substrates is only 5.142%, showing the highest density of 3.129 g/cm3. At the same time, it has a maximum dielectric constant of 6.681(20 GHz) and a lower dielectric loss of 1.058×10-3(20 GHz), and the bending strength reaches a maximum of 217.946 MPa.. In contrast, excessively fine particle size of glass powder leads to slurry agglomeration and premature crystallization, causing mismatched densification and grain growth and ultimately deteriorating the final density. This study highlights the key role of particle size of glass powder on sintering behavior and provides a reference for the subsequent design of high-frequency LTCC composite materials.

Key words: particle size of glass powder, composite ceramics, LTCC, sintering densification, dielectric property, sintered substrate

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