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BULLETIN OF THE CHINESE CERAMIC SOCIETY ›› 2025, Vol. 44 ›› Issue (8): 2988-2995.DOI: 10.16552/j.cnki.issn1001-1625.2025.0111

• Ceramics • Previous Articles     Next Articles

Effect of Sintering Schedule on Performance of Ceramic Bond Diamond Grinding Wheel

RUAN Jiahao1, ZHANG Lei1,2, LI Yujia3   

  1. 1. Faculty of Mechanical Engineering and Mechanics, Ningbo University, Ningbo 315211, China;
    2. Ningbo Intelligent Machine Tool Research Institute Co., Ltd. of China National Machinery Institute Group, Ningbo 315700, China;
    3. Ningbo Songlan Cutting Tools Technology Co., Ltd., Ningbo 315700, China
  • Received:2025-01-27 Revised:2025-04-20 Online:2025-08-15 Published:2025-08-22

Abstract: To meet the performance requirements of ceramic bond diamond grinding wheels for precision machining, this study investigated the effect of sintering schedule (sintering temperature and holding time) on the grinding wheel properties by altering these parameters. Grinding wheel samples were characterized using scanning electron microscope, X-ray diffractometer, Rockwell hardness testing, Archimedes' drainage method, and three-point bending tests to determine the optimal sintering temperature and holding time. The results show that within the experimental parameter ranges of sintering temperature (670~750 ℃) and holding time (60~180 min), the phase composition of the grinding wheel samples remains unchanged, consisting of diamond and LixAlxSi3-xO6. The sintering temperature has a more significant effect on the grinding wheel performance than the holding time. The optimal sintering temperature is 710 ℃, at which the grinding wheel sample exhibits a bending strength of 106.92 MPa, Rockwell hardness of 90.6 HRB, volume shrinkage rate of 10.48%, and porosity of 9.36%. The optimal holding time range is 90~150 min, during which the porosity and volume shrinkage rate of the grinding wheel samples remain at approximately 10%, the bending strength is around 107 MPa, and the Rockwell hardness is approximately 90.5 HRB.

Key words: diamond grinding wheel, ceramic bond, sintering temperature, holding time, micromorphology, mechanical property

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