光固化3D打印Csf/SiC坯体的显微结构与力学性能

doi:10.16552/j.cnki.issn1001-1625.2024.0919

硅酸盐通报 ›› 2025, Vol. 44 ›› Issue (2): 666-678.DOI: 10.16552/j.cnki.issn1001-1625.2024.0919

光固化3D打印C_sf/SiC坯体的显微结构与力学性能

胡传奇¹, 王功¹, 李珊¹, 靳宝杰¹, 刘兵山¹, 洪义强², 戴珍², 汪体园², 王爽²

1.中国科学院空间应用工程与技术中心,北京 100094;
2.北京机电工程总体设计部,北京 100005

收稿日期:2024-08-05 修订日期:2024-10-23 出版日期:2025-02-15 发布日期:2025-02-28
通信作者: 李珊,博士,副研究员。E-mail:lishan@csu.ac.cn
作者简介:胡传奇(1986—),男,博士,高级工程师。主要从事陶瓷增材制造工艺的研究。E-mail:huchuanqi@csu.ac.cn
基金资助:
HY陶瓷基复合材料快速制备技术(T3144011XN)

Microstructure and Mechanical Properties of 3D Printed C_sf/SiC Green Body Based on Vat Photopolymerization

HU Chuanqi¹, WANG Gong¹, LI Shan¹, JIN Baojie¹, LIU Bingshan¹, HONG Yiqiang², DAI Zhen², WANG Tiyuan², WANG Shuang²

1. Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences, Beijing 100094, China;
2. General Design Department of Beijing Electromechanical Engineering, Beijing 100005, China

Received:2024-08-05 Revised:2024-10-23 Published:2025-02-15 Online:2025-02-28

摘要/Abstract

摘要： 短切碳纤维增强碳化硅复合材料(C_sf/SiC)是一种高性能陶瓷基复合材料,光固化3D打印工艺能够弥补传统工艺在复杂精细结构C_sf/SiC部件精密制造方面的不足。本文以短切碳纤维(C_sf)、碳化硅(SiC)微粉和光敏树脂为原料制备了光敏树脂基C_sf/SiC浆料,通过光固化3D打印工艺得到了刮刀运动方向平行和垂直于试条长度方向的试条(分别记为A和B),比较了两种试条脱脂前后抗弯强度、韦伯模数、尺寸和质量的变化。研究表明:A试条具有更高强度和结构均一性,其密度、抗弯强度和韦伯模数分别为1.81 g/cm³、10.68 MPa和13.22;脱脂后坯体密度、抗弯强度和韦伯模数分别降至1.40 g/cm³、7.32 MPa和9.45,在X、Y、Z方向上的脱脂收缩率分别为1.22%、3.35%和4.24%,坯体脆性增加,韧性降低。化学气相渗透(CVI)工艺能够实现C_sf/SiC样品的致密化、强韧化和均一化,脱脂后的C_sf/SiC样品经CVI渗碳后增重约50%,密度、致密度、抗弯强度和韦伯模数分别为2.02 g/cm³、93.88%、121.22 MPa和21.04。

关键词: C_sf/SiC, 3D打印, 光固化, 显微结构, 力学性能, 化学气相渗透

Abstract: Short cut carbon fiber reinforced silicon carbide composite (C_sf/SiC) is a kind of high-performance ceramic matrix composite. Vat photopolymerization 3D printing can make up for the shortcomings of traditional process in the precision manufacturing of complex fine structure C_sf/SiC components. In this paper, the photosensitive resin based C_sf/SiC slurry was prepared with short cut carbon fiber (C_sf), silicon carbide (SiC) micropowder and photosensitive resin. The test strips (A and B) with the movement direction of the scraper parallel to and perpendicular to the length direction of the test strip were obtained by the Vat photopolymerization 3D printing process. The changes of bending strength, Weibull modulus, size and weight of the two kinds of test strips before and after debonding were compared. The results show that the A test strip has higher strength and structural uniformity, and its density, bending strength and Weibull modulus are 1.81 g/cm³, 10.68 MPa and 13.22, respectively. After debonding, the density, bending strength and Weibull modulus of the green body decrease to 1.40 g/cm³, 7.32 MPa and 9.45, respectively. The debonding shrinkage in X, Y, Z direction are 1.22%, 3.35% and 4.24%, respectively. The brittleness of the green body increases and the toughness decreases. The chemical vapor infiltration (CVI) process can achieve the densification, toughening and homogenization of C_sf/SiC samples. The weight of debinded C_sf/SiC samples after CVI carburization increases about 50%, and the density, compactness, bending strength and Weibull modulus are 2.02 g/cm³, 93.88%, 121.22 MPa and 21.04, respectively.

Key words: C_sf/SiC, 3D printing, Vat photopolymerization, microstructure, mechanical property, chemical vapor infiltration

中图分类号:

TQ174

胡传奇, 王功, 李珊, 靳宝杰, 刘兵山, 洪义强, 戴珍, 汪体园, 王爽. 光固化3D打印C_sf/SiC坯体的显微结构与力学性能[J]. 硅酸盐通报, 2025, 44(2): 666-678.

HU Chuanqi, WANG Gong, LI Shan, JIN Baojie, LIU Bingshan, HONG Yiqiang, DAI Zhen, WANG Tiyuan, WANG Shuang. Microstructure and Mechanical Properties of 3D Printed C_sf/SiC Green Body Based on Vat Photopolymerization[J]. BULLETIN OF THE CHINESE CERAMIC SOCIETY, 2025, 44(2): 666-678.

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光固化3D打印C_sf/SiC坯体的显微结构与力学性能

Microstructure and Mechanical Properties of 3D Printed C_sf/SiC Green Body Based on Vat Photopolymerization

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光固化3D打印Csf/SiC坯体的显微结构与力学性能

Microstructure and Mechanical Properties of 3D Printed Csf/SiC Green Body Based on Vat Photopolymerization

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光固化3D打印C_sf/SiC坯体的显微结构与力学性能

Microstructure and Mechanical Properties of 3D Printed C_sf/SiC Green Body Based on Vat Photopolymerization