Research Progress of Ultra-Precision Surface Grinding and Polishing Abrasive Particles

Abstract

Abstract: Ultra-precision processing of semiconductor materials is a technology that achieves high surface quality and surface integrity. Grinding and polishing abrasive particles are one of the key consumables for achieving ultra-precision processing of semiconductor materials. The research status and development trend of grinding and polishing abrasive particles based on their composition and structural characteristics were summarized. Firstly, the contact model between the workpiece, abrasive particles and pad in the grinding and polishing interface was constructed, and the influences of the material, shape, concentration, and particle size of abrasive particles on the quality and efficiency of the grinding and polishing were discussed. Secondly, the grinding and polishing performance and the corresponding mechanism of mixed abrasive particles were introduced from the aspects of material and particle size. Thirdly, the application of composite abrasive particles in ultra-precision processing technology was summarized from the perspective of material structure and chemical action. Finally, the future research direction of grinding and polishing abrasive particles was prospected.

Key words: abrasive particle, mixed abrasive particle, composite abrasive particle, grinding, polishing, ultra-precision surface

CLC Number:

O786
TN305.2

ZHOU Zhaofeng, HONG Juan, HUANG Chuanjin. Research Progress of Ultra-Precision Surface Grinding and Polishing Abrasive Particles[J]. BULLETIN OF THE CHINESE CERAMIC SOCIETY, 2021, 40(3): 1007-1015.

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