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硅酸盐通报 ›› 2025, Vol. 44 ›› Issue (6): 2269-2279.DOI: 10.16552/j.cnki.issn1001-1625.2024.1508

• 陶瓷 • 上一篇    下一篇

放电等离子烧结致密化钛酸铝陶瓷的制备与性能研究

蒋梦婷, 邓腾飞   

  1. 武汉理工大学硅酸盐建筑材料国家重点实验室,武汉 430070
  • 收稿日期:2024-12-06 修订日期:2025-01-23 发布日期:2025-06-27
  • 通信作者: 邓腾飞,博士,研究员。E-mail:dengtf@whut.edu.cn
  • 作者简介:蒋梦婷(1992—),女,博士。主要从事陶瓷制备方面的研究。E-mail:jiang354357824@whut.edu.cn
  • 基金资助:
    国家重点研发计划(2019YFC1904900)

Preparation and Properties of Dense Aluminum Titanate Ceramics via Spark Plasma Sintering

JIANG Mengting, DENG Tengfei   

  1. State Key Laboratory of Silicate Materials for Architectures, Wuhan University of Technology, Wuhan 430070, China
  • Received:2024-12-06 Revised:2025-01-23 Online:2025-06-27

摘要: 钛酸铝(Al2TiO5)具有高熔点、低热膨胀系数及优异的抗热震性能,在耐火材料等领域具有广泛应用。然而,Al2TiO5的烧结致密性较差,限制了其进一步发展。本文采用放电等离子烧结(SPS)技术制备了致密的Al2TiO5陶瓷,并比较了SPS和无压烧结两种方法对Al2TiO5陶瓷致密性的影响。结果表明,在1 350 ℃、60 MPa、10 min的烧结条件下,SPS制备的Al2TiO5陶瓷致密性最高。与无压烧结相比,SPS制备的Al2TiO5陶瓷显气孔率从(11.34±0.53)%降低至(2.41±0.61)%,而体积密度从(3.09±0.01) g/cm3增加至(3.64±0.02) g/cm3,相对密度从(83.97±0.22)%增加至(97.85±0.43)%。

关键词: 钛酸铝, 致密性, 放电等离子烧结, 扩散蠕变, 晶界滑移

Abstract: Aluminum titanate (Al2TiO5) is widely utilized in refractory materials due to its high melting point, low thermal expansion coefficient, and exceptional thermal shock resistance. However, the poor sintering densification of Al2TiO5 limits its broader application. In this paper, dense Al2TiO5 ceramics were prepared by spark plasma sintering (SPS), and the effects of SPS and pressureless sintering on the densification of Al2TiO5 ceramics were compared. The results indicate that Al2TiO5 ceramics prepared via SPS exhibit the highest density at 1 350 ℃, 60 MPa and 10 min sintering condition. Compared to pressureless sintering, the apparent porosity of Al2TiO5 ceramics prepared by SPS decreases from (11.34±0.53)% to (2.41±0.61)%. Additionally, the bulk density increases from (3.09±0.01) g/cm3 to (3.64±0.02) g/cm3, and the relative density improves from (83.97±0.22)% to (97.85±0.43)%.

Key words: aluminum titanate, densification, spark plasma sintering, diffusion creep, grain boundary sliding

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