Reliable Sealing Technology for Phosphate Glass and Copper Based on Interface Reinforcement

doi:10.16552/j.cnki.issn1001-1625.2025.1190

Abstract

Abstract:

In response to the demand for high-reliability applications in the field of electronic packaging， a novel sealing process of phosphate glass based on copper substrate has been developed. Through a stepwise pre-oxidation treatment of the copper substrate in a muffle furnace and a tube furnace， a dense Cu₂O transition layer with a thickness of approximately 1.81 μm was successfully constructed on its surface. The thermal behavior and crystallization characteristics of the phosphate glass were systematically investigated. Results indicate an exothermic crystallization peak near 632 ℃， with the primary crystalline phase being BaZnP₂O₇. Complete melting and spreading of the glass on the pre-oxidized copper substrate are achieved at 555 ℃. Within the sealing temperature range of 560~580 ℃， the glass exhibits good wettability on the Cu₂O layer. The sealed devices demonstrates excellent hermeticity （helium leakage rate below 1×10^-10 Pa·m³·s^-1） and shear strength （peak value of （110.5±13.0） MPa）. After undergoing 100 thermal cycles between room temperature and 100 ℃， the key performance metrics of the sealed devices show no significant degradation， indicating good service reliability of the sealing system.

Key words: electronic sealing, phosphate glass, copper oxidation, crystallization behavior, hermeticity, reliability

CLC Number:

TQ171

LAN Yang, WANG Yanhang, YIN Xianyin, LIAO Qilong, WANG Fu, ZHU Hanzhen. Reliable Sealing Technology for Phosphate Glass and Copper Based on Interface Reinforcement[J]. BULLETIN OF THE CHINESE CERAMIC SOCIETY, 2026, 45(4): 1398-1407.

Figures/Tables 9

Fig.1 Schematic diagram of sealing structure

Fig.2 Schematic diagram of shear strength test

Fig.3 Oxide on copper substrate surface after pre-oxidation

Fig.4 Morphology of copper substrate cross-section and element change of EDS line scanning

Table 1 Images of glass on copper substrate surface at different temperatures

Sample	Sintering temperature	Softening temperature	Sphere temperature	Halfsphere temperature	Melting temperature	Maximum test temperature
Glass

Fig.5 Glass crystallization analysis at different temperatures

Fig.6 Thermal properties of glass at different sealing temperatures

Fig.7 Performance of sealed device at different sealing temperatures

Fig.8 Performance of sealed device after different thermal cycles

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