3D Packaging Optical Fiber Microchannels Preparation Technology Based on TGV

doi:10.16552/j.cnki.issn1001-1625.2025.1094

Abstract

Abstract:

To overcome the limitations of traditional laser drilling and other technologies in the preparation of glass-based array through-holes， such as thermal damage， poor hole shape， and low hole density， and to meet the demand for high-precision interconnection carriers in 3D packaging of optoelectronic devices， this paper investigates the preparation of 3D packaging optical fiber microchannels based on through glass via （TGV）. Special core and clad glass optical fiber raw materials were used to prepare optical fiber preforms， which were then processed through drawing， rod and plate arrangement， hot pressing， and acid etching to produce optical fiber microchannel arrays. Research indicates that this technology exhibits minimal thermal effects. By adjusting process parameters， the aperture deviation of fiber units can be precisely controlled within ±1 μm， enabling the formation of taper-free through hole structures in fibers after acid etching. This significantly enhances both via drilling density and aspect ratio consistency. This process offers a high-precision， low-cost solution for optoelectronic interconnects in 3D packaging， playing a significant role in advancing the integration of 3D packaging technology for optoelectronic devices.

Key words: TGV, 3D packaging, optical fiber glass, optical fiber microchannel, through-hole array

CLC Number:

TN43

MA Xixiang, YU Changjiang, LI Ning, SUN Haorui, WANG Zizhou, LIU Haoran, MING Yuetong, REN Hongyu, WANG Sanzhao. 3D Packaging Optical Fiber Microchannels Preparation Technology Based on TGV[J]. BULLETIN OF THE CHINESE CERAMIC SOCIETY, 2026, 45(3): 1031-1037.

Figures/Tables 10

Fig.1 Relationship curve of corrosion mass and time for surface acid etching

Fig.2 Flowchart of optical fiber microchannels fabrication

Fig.3 Schematic diagram of optical fiber drawing process

Fig.4 Schematic diagram of internal structure of drawing furnace

Fig.5 Photos of optical fiber rod and plate arrangement

Fig.6 Hot pressing pressure process curves

Fig.7 Secondary annealing process curve

Fig.8 Macroscopic photo of 4-inch 3D packaging optical fiber slab

Fig.9 SEM image of microchannel array

Fig.10 SEM image of microchannel inner wall

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