[1] 张建军, 李树杰. 非氧化物陶瓷连接技术的进展[J]. 硅酸盐学报, 2002, 30(1): 102-107. ZHANG J J, LI S J. Progresses of joining techniques of nonoxide ceramics[J]. Journal of the Chinese Ceramic Society, 2002, 30(1): 102-107 (in Chinese). [2] 王恩会, 杨亚锟, 侯新梅. 非氧化物陶瓷氧化动力学的研究现状与进展[J]. 工程科学学报, 2022, 44(4): 654-663. WANG E H, YANG Y K, HOU X M. Current research and development on the oxidation kinetics of nonoxide ceramics[J]. Chinese Journal of Engineering, 2022, 44(4): 654-663 (in Chinese). [3] 徐谱昊. Al-Ti合金对非氧化物陶瓷高温润湿和钎焊的界面行为与接头力学性能研究[D]. 镇江: 江苏大学, 2022. XU P H. Study on the interface behavior and joint mechanical properties of Al-Ti alloy for high temperature wetting and brazing of nonoxide ceramics[D]. Zhenjiang: Jiangsu University, 2022 (in Chinese). [4] 易 丹, 王 捷, 陈卫民, 等. AlN陶瓷间的AgCuTi活性焊膏封接[J]. 电子工艺技术, 2018, 39(2): 63-65+70. YI D, WANG J, CHEN W M, et al. Sealing and bonding of AgCuTi active solder paste between AlN ceramics[J]. Electronics Process Technology, 2018, 39(2): 63-65+70 (in Chinese). [5] 范彬彬, 赵 林, 谢志鹏. 陶瓷与金属连接的研究及应用进展[J]. 陶瓷学报, 2020, 41(1): 9-21. FAN B B, ZHAO L, XIE Z P. Progress in research and application of joining of ceramics and metals[J]. Journal of Ceramics, 2020, 41(1): 9-21 (in Chinese). [6] 贡 昊, 顾 臻, 王金竹. 非氧化物陶瓷与金属接合的热处理设备[J]. 真空电子技术, 2016(5): 54-57. GONG H, GU Z, WANG J Z. Heat treatment equipments for nonoxide ceramic-metal bonding[J]. Vacuum Electronics, 2016(5): 54-57 (in Chinese). [7] 饶程杰, 万维财, 王 鹏, 等. 陶瓷/金属扩散焊研究现状[J]. 材料热处理学报, 2023, 44(4): 13-23. RAO C J, WAN W C, WANG P, et al. Research status of ceramic/metal diffusion welding[J]. Transactions of Materials and Heat Treatment, 2023, 44(4): 13-23 (in Chinese). [8] 常春梅. 陶瓷与金属间的焊接技术研究[J]. 佛山陶瓷, 2024, 34(3): 57-59. CHANG C M. Research on welding technology between ceramics and metals[J]. Foshan Ceramics, 2024, 34(3): 57-59 (in Chinese). [9] 赵经香, 李希超, 戴作强, 等. 陶瓷/金属焊接技术研究现状及发展[J]. 材料科学与工程学报, 2023, 41(6): 1011-1021. ZHAO J X, LI X C, DAI Z Q, et al. Research status and development trend of joining ceramics to metals by welding technology[J]. Journal of Materials Science and Engineering, 2023, 41(6): 1011-1021 (in Chinese). [10] 徐圆圆. 陶瓷修复过程中金属材料加工和封接技术[J]. 铸造, 2022, 71(5): 667. XU Y Y. Metal material processing and sealing technology during ceramic restoration process[J]. Foundry, 2022, 71(5): 667 (in Chinese). [11] 曲文卿, 齐志刚, 庄鸿寿. 陶瓷与金属电子器件的绿色活性封接技术[J]. 电子器件, 2007, 30(2): 376-379+383. QU W Q, QI Z G, ZHUANG H S. Green active packaging process of ceramic to metal for electron device[J]. Chinese Journal of Electron Devices, 2007, 30(2): 376-379+383 (in Chinese). [12] 贾 佳. 陶瓷-不锈钢封接研究[D]. 成都: 电子科技大学, 2006. JIA J. Research on ceramic-stainless steel sealing[D]. Chengdu: University of Electronic Science and Technology of China, 2006 (in Chinese). [13] 徐树森, 向 兵. 电真空器件中陶瓷-金属封接应力分析[J]. 真空电子技术, 2021(4): 72-76. XU S S, XIANG B. Stress analysis of ceramic-metal sealing in vacuum electronic devices[J]. Vacuum Electronics, 2021(4): 72-76 (in Chinese). [14] XIN C L, YAN J Z, WANG Q Y, et al. The microstructural evolution and formation mechanism in Si3N4/AgCuTi/Kovar braze joints[J]. Journal of Alloys and Compounds, 2020, 820: 153189. [15] ZHANG Y, CHEN Y K, YU D S, et al. A review paper on effect of the welding process of ceramics and metals[J]. Journal of Materials Research and Technology, 2020, 9(6): 16214-16236. [16] ONG F S, RHEINGANS B, GOTO K, et al. Residual stress induced failure of Ti-6Al-4V/Si3N4 joints brazed with Ag-Cu-Ti filler: the effects of brazing zone’s elasto-plasticity and ceramics' intrinsic properties[J]. Journal of the European Ceramic Society, 2021, 41(13): 6319-6329. [17] ASTHANA R, SINGH M, SOBCZAK N. The role of wetting and reactivity in infiltration of ceramic-metal composites[M].Hoboken: John Wiley & Sons, Inc., 2008: 248-261. [18] 董文伟, 牛济泰, 高增. 陶瓷与金属钎焊残余应力研究综述[J]. 热加工工艺, 2024(7): 14-18+29. DONG W W, NIU J T, GAO Z. Review of residual stress of ceramic/metal brazing[J]. Hot working technology, 2024(7): 14-18+29 (in Chinese). [19] 张卫之, 程焰林, 马迎英. 无机非金属材料与金属材料连接的研究概述[J]. 焊接技术, 2015, 44(1): 1-4. ZHANG W Z, CHENG Y L, MA Y Y. Overview of research on the connection between inorganic non-metallic materials and metallic materials[J]. Welding Technology, 2015, 44(1): 1-4 (in Chinese). [20] 高陇桥. 非氧化物陶瓷-金属接合及其机理[J]. 真空电子技术, 1995(2): 1-6. GAO L Q. Nonoxide-ceramics to metal joint and its mechanism[J]. Vacuum Electronics, 1995(2): 1-6 (in Chinese). [21] 刘 诚, 何兴会, 全 锋, 等. 大尺寸件氧化铝陶瓷与可伐合金的钎焊封接工艺研究[J]. 材料导报, 2019, 33(增刊2): 202-205+221. LIU C, HE X H, QUAN F, et al. Technical research on the brazing of alumina ceramic and kovar alloy for big size workpiece[J]. Materials Reports, 2019, 33(supplement 2): 202-205+221 (in Chinese). [22] 李华平, 杜大明, 赵世坤. 陶瓷的封接技术及研究进展[J]. 佛山陶瓷, 2004, 14(6): 39-41. LI H P, DU D M, ZHAO S K. Research progress of bonding technology of ceramics[J]. Foshan Ceramics, 2004, 14(6): 39-41 (in Chinese). [23] 王星星, 吴 港, 何 鹏, 等. 陶瓷/金属异质钎焊连接研究进展[J]. 稀有金属材料与工程, 2022, 51(7): 2689-2697. WANG X X, WU G, HE P, et al. Research progress of ceramic/metal dissimilar brazing technology[J]. Rare Metal Materials and Engineering, 2022, 51(7): 2689-2697 (in Chinese). [24] RAJENDRAN S H, HWANG S J, JUNG J P. Active brazing of alumina and copper with multicomponent Ag-Cu-Sn-Zr-Ti filler[J]. Metals, 2021, 11(3): 509. [25] 高陇桥. 陶瓷-金属材料实用封接技术[M]. 北京: 化学工业出版社, 2018. GAO L Q. Practical sealing technology for ceramic-metal materials[M]. Beijing: Chemical Industry Press, 2018 (in Chinese). [26] 陆艳杰, 张小勇, 楚建新, 等. Ag-Cu-Ti活性法封接AlN陶瓷与Mo-Cu合金[J]. 真空电子技术, 2009(4): 14-18. LU Y J, ZHANG X Y, CHU J X, et al. Active brazing AlN ceramic and Mo-Cu alloy using Ag-Cu-Ti[J]. Vacuum Electronics, 2009(4): 14-18 (in Chinese). [27] LIU Y, HUANG Z R, LIU X J. Joining of sintered silicon carbide using ternary Ag-Cu-Ti active brazing alloy[J]. Ceramics International, 2009, 35(8): 3479-3484. [28] 任 欢. SiC陶瓷与不锈钢层状材料的连接技术[D]. 天津: 河北工业大学, 2014. REN H. Connection technology between SiC ceramics and stainless steel layered materials[D]. Tianjin: Hebei University of Technology, 2014 (in Chinese). [29] 鲁燕萍. 陶瓷与金属的活性封接[J]. 真空电子技术, 2003(4): 51-53. LU Y P. Joining of ceramic to metal by active metal brazing[J]. Vacuum Electronics, 2003(4): 51-53 (in Chinese). [30] 刘 征, 王腾飞, 张伟儒, 等. 氮化硅陶瓷及其与金属的接合技术[J]. 真空电子技术, 2015(4): 1-5. LIU Z, WANG T F, ZHANG W R, et al. Silicon nitride ceramics and ceramics-metal sealing technology[J]. Vacuum Electronics, 2015(4): 1-5 (in Chinese). [31] XU X P, WANG Y, ZOU J S, et al. Interfacial microstructure and properties of Si3N4 ceramics/Cu/304 stainless steel brazed by Ti40Zr25B0.2Cu amorphous solder[J]. Materials, 2018, 11(11): 2226. [32] 杜仲杰, 李 丹, 张雨欣, 等. Cu-Ti复合焊料钎焊Si3N4陶瓷/Cu的显微结构和力学性能研究[J]. 陶瓷学报, 2024, 45(3): 566-574. DU Z J, LI D, ZHANG Y X, et al. Microstructure and mechanical properties of Cu-Ti composite soldering brazed Si3N4/Cu joint[J]. Journal of Ceramics, 2024, 45(3): 566-574 (in Chinese). [33] GUI X, ZHANG M F, ZHANG X Z, et al. Theoretical investigations on interfacial behavior of Ag-Cu-Ti/Si3N4 wetting system[J]. Journal of Nanoelectronics and Optoelectronics, 2021, 16(11): 1780-1790. |