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硅酸盐通报 ›› 2026, Vol. 45 ›› Issue (3): 794-805.DOI: 10.16552/j.cnki.issn1001-1625.2025.1073

• 玻璃本构与模拟计算 • 上一篇    下一篇

锂铝硅超薄玻璃离子交换应力演化与高速应变强度表征研究

胡伟1,2(), 田英良3, 黄文泽4   

  1. 1.北京大学深圳研究生院,科学智能学院,深圳 518055
    2.北京大学深圳研究生院,广东省多维度光电材料工程技术研究中心,深圳 518055
    3.北京工业大学材料科学与工程学院,北京 100124
    4.加州大学圣塔芭芭拉分校物理学院,圣塔芭芭拉 93106
  • 收稿日期:2025-11-01 修订日期:2025-12-11 出版日期:2026-03-20 发布日期:2026-04-10
  • 作者简介:胡 伟(1977—),男,博士,特聘研究员。主要从事高强度力学玻璃、微晶玻璃方面的研究。E-mail:8185085@qq.com
  • 基金资助:
    广东省柔性光电材料与器件重点实验室(2021KSYS003);广东省光电材料器件技术国际科技合作基地(2019A050505003);广东省多维度光电子材料工程技术研究中心(2024B195);深圳市柔性显示纳米光电材料工程研究中心(XMHT20220106002);深圳市有机光电磁功能材料重点实验室(ZDSYS2014050909411)

Ion Exchanged Stress Evolution and High-Speed Strain Strength Characterization of Lithium Aluminosilicate Ultra-Thin Glass

HU Wei1,2(), TIAN Yingliang3, HUANG Wenze4   

  1. 1.School of AI for Science,Peking University Shenzhen Graduate School,Shenzhen 518055,China
    2.Guangdong Engineering Technology Research Center of Multi-Dimensional Optoelectronic Materials,Peking University Shenzhen Graduate School,Shenzhen 518055,China
    3.School of Materials Science and Engineering,Beijing University of Technology,Beijing 100124,China
    4.Department of Physics,University of California Santa Barbara,Santa Barbara 93106,US
  • Received:2025-11-01 Revised:2025-12-11 Published:2026-03-20 Online:2026-04-10

摘要:

本文针对锂铝硅(LAS)超薄玻璃在离子交换(IOX)工艺中的应力形成与松弛机制展开研究。通过构建“菲克互扩散-化学自由体积膨胀-弹性约束”耦合理论框架,推导了适用于薄板条件下的应力计算公式,系统分析了温度(380~500 ℃)与时间对表面压应力(CS)、压应力层深度(DOL)及张应力线密度(CTLD)的影响规律。结果表明:在短周期纯NaNO3熔盐IOX过程中,CTLD呈典型“快速上升-峰值-回落”的单峰演化趋势,随着温度升高,CTLD峰值从34 000 MPa降低至27 000 MPa,这反映出扩散驱动的应力积累与自由体积耗散致应力松弛的竞争机制。基于质量增量反演获得相互扩散系数(D0≈1.078 79×10-12 cm2/s,Ea≈83.29 kJ/mol),并结合CTLD实测数据,建立了自由体积指数Bt)的一阶动力学松弛模型,揭示了“温度-黏度-松弛速率”的定量关系。研究表明,CTLD较传统CS/DOL更能有效地表征超薄玻璃在高速应变工况下的抗冲击性能,这为超薄玻璃强化工艺的优化提供了理论基础。

关键词: 超薄玻璃, 离子交换, 张应力线密度, 自由体积指数, 应力松弛, 高速应变

Abstract:

This study investigates the stress formation and relaxation mechanisms of lithium aluminosilicate (LAS) ultra-thin glass during ion exchange (IOX) process. By constructing a coupled theoretical framework of “Fickian interdiffusion-chemical free volume expansion-elastic constraint”, a stress calculation formula suitable for thin-plate conditions was derived. Effects of temperature (380~500 ℃) and time on surface compressive stress (CS), depth of layer (DOL), and central tension linear density (CTLD) were systematically analyzed. The results show that during short-cycle IOX in pure NaNO3 molten salt, CTLD value follows a typical single-peak evolution trend of “rapid rise-peak-decline.” As temperature increases, the peak CTLD value decreases from 34 000 MPa to 27 000 MPa, reflecting the competing mechanisms between diffusion-driven stress accumulation and free-volume dissipation-induced relaxation. Based on the inversion of mass gain measurements, the mutual diffusion coefficient is extracted (D0≈1.078 79×10-12 cm2/s, Ea≈83.29 kJ/mol). Combined with experimental CTLD data, a first-order kinetic model for the free-volume index Bt) is constructed, revealing a quantitative relationship among “temperature-viscosity-relaxation rate”. This study suggests that CTLD provides a more accurate characterization of the impact resistance of ultra-thin glass under high-speed strain conditions compared to conventional CS and DOL parameters, providing a theoretical basis for optimizing the strengthening process of ultra-thin glass.

Key words: ultra-thin glass, ion exchange, CTLD, free volume index, stress relaxation, high-speed strain

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