玻璃基板在芯片封装中的应用和性能要求

doi:10.16552/j.cnki.issn1001-1625.2024.0916

摘要/Abstract

摘要： 玻璃基板凭借优异的高频电学性能、热稳定性和化学稳定性,有望成为先进封装技术中的关键材料。本文通过分析玻璃基板在封装过程中的作用与优势,探讨了玻璃基板在中介层、扇出型封装、微机电系统封装和集成天线封装等先进封装技术中的应用,总结了未来芯片封装用玻璃基板的常见成分体系及主要理化性能参数,并对玻璃基板未来的应用发展进行了展望。

关键词: 玻璃基板, 芯片封装, 玻璃通孔, 硼硅玻璃, 铝硅玻璃, 无碱玻璃

Abstract: Glass substrates are set to become a critical material in advanced packaging technologies due to their superior high-frequency electrical properties, thermal stability, and chemical durability.This paper examines the roles and advantages of glass substrates in the packaging process, highlighting their applications in intermediary layers, fan-out packaging, micro-electro-mechanical system packaging, and integrated antenna packaging. This paper also summarizes the common composition and key physicochemical properties of glass substrates used in chip packaging, and provides insights into their future development.

Key words: glass substrate, chip packaging, through glass via, borosilicate glass, aluminum-silicon glass, alkali-free glass

中图分类号:

TQ171.73

张兴治, 田英良, 赵志永, 张迅, 王如志. 玻璃基板在芯片封装中的应用和性能要求[J]. 硅酸盐通报, 2025, 44(2): 707-716.

ZHANG Xingzhi, TIAN Yingliang, ZHAO Zhiyong, ZHANG Xun, WANG Ruzhi. Application and Performance Requirements of Glass Substrates in Chip Packaging[J]. BULLETIN OF THE CHINESE CERAMIC SOCIETY, 2025, 44(2): 707-716.

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