烧结升温速率对低温共烧陶瓷基板性能的影响

硅酸盐通报 ›› 2022, Vol. 41 ›› Issue (3): 1039-1043.

烧结升温速率对低温共烧陶瓷基板性能的影响

侯清健, 游韬, 王子鸣, 谢廉忠

南京电子技术研究所,南京 210039

收稿日期:2021-11-11 修回日期:2022-01-01 出版日期:2022-03-15 发布日期:2022-04-08
作者简介:侯清健(1978—),男,高工。主要从事LTCC/HTCC工艺技术研究。E-mail:ltcc2009@sina.com
基金资助:
上海市军民融合专项(JMRH-2018-1059);装备预研领域基金(61409230705)

Effect of Sintering Heating Rate on Properties of Low Temperature Co-Fired Ceramic Substrate

HOU Qingjian, YOU Tao, WANG Ziming, XIE Lianzhong

Nanjing Research Institute of Electronics Technology, Nanjing 210039, China

Received:2021-11-11 Revised:2022-01-01 Online:2022-03-15 Published:2022-04-08

摘要/Abstract

摘要： 烧结是低温共烧陶瓷(LTCC)基板工艺中关键工序之一,对LTCC基板的各项性能指标具有重要的影响。本文以国产MG60生瓷带为研究对象,研究了不同烧结升温速率对LTCC基板介电性能、翘曲度、膜层附着力、抗折强度等性能指标的影响,分析了基板性能变化的原因。结果表明,当升温速率为8 ℃/min时,基板介电常数为5.788,介电损耗为8.21×10^-4,基本无翘曲,烧结致密,附着力强,抗折强度达到175 MPa。

关键词: 低温共烧陶瓷, 升温速率, 介电性能, 翘曲度, 附着力, 抗折强度

Abstract: Sintering is one of the key processes in preparing low temperature co-fired ceramic (LTCC) substrate, which plays an important role on the properties of LTCC substrate. In this paper, the effects of different sintering heating rates on the dielectric properties, warpage, film adhesion and flexural strength of LTCC substrate were studied, and the reasons for the changes of substrate properties were analyzed. The results show that when the heating rate is 8 ℃/min, the dielectric constant of the substrate is 5.788 and the dielectric loss is 8.21×10^-4. The substrate basically has no warpage, high density, strong adhesion, and the flexural strength of the substrate is up to 175 MPa。

Key words: low temperature co-fired ceramic, heating rate, dielectric property, warpage, adhesion, flexural strength

中图分类号:

TQ174.65

侯清健, 游韬, 王子鸣, 谢廉忠. 烧结升温速率对低温共烧陶瓷基板性能的影响[J]. 硅酸盐通报, 2022, 41(3): 1039-1043.

HOU Qingjian, YOU Tao, WANG Ziming, XIE Lianzhong. Effect of Sintering Heating Rate on Properties of Low Temperature Co-Fired Ceramic Substrate[J]. BULLETIN OF THE CHINESE CERAMIC SOCIETY, 2022, 41(3): 1039-1043.

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