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硅酸盐通报 ›› 2022, Vol. 41 ›› Issue (10): 3675-3679.

• 陶瓷 • 上一篇    下一篇

微波烧结陶瓷结合剂金刚石砂轮研究

张於亮, 汪振华, 姜志嵩, 张铁   

  1. 南京理工大学机械工程学院,南京 210000
  • 收稿日期:2022-06-02 修回日期:2022-08-17 出版日期:2022-10-15 发布日期:2022-10-26
  • 通讯作者: 汪振华,博士,教授。E-mail:13770654600@163.com
  • 作者简介:张於亮(1996—),男,硕士研究生。主要从事陶瓷结合剂金刚石砂轮方面的研究。E-mail:1239336096@qq.com
  • 基金资助:
    国家重点研发计划重点专项课题(2018YFB2001303)

Study on Microwave Sintering of Ceramic Bonded Diamond Grinding Wheels

ZHANG Yuliang, WANG Zhenhua, JIANG Zhisong, ZHANG Tie   

  1. School of Mechanical Engineering, Nanjing University of Science and Technology, Nanjing 210000, China
  • Received:2022-06-02 Revised:2022-08-17 Online:2022-10-15 Published:2022-10-26

摘要: 为了提高陶瓷结合剂金刚石砂轮的性能,采用微波烧结技术,通过一系列试验,分析了陶瓷结合剂金刚石砂轮的微波烧结温度、陶瓷结合剂含量和金刚石磨料粒度对其性能的影响。结果表明:微波烧结温度是影响陶瓷结合剂金刚石砂轮性能的最主要因素,远超其余二者;陶瓷结合剂金刚石砂轮试样的洛氏硬度和抗弯强度在740 ℃时达到极大值且气孔率较小,此时洛氏硬度为66 HRB,抗弯强度为76.5 MPa,气孔率为17.8%;由微观组织观察可知陶瓷结合剂金刚石砂轮在740 ℃时可以实现陶瓷结合剂对金刚石磨料的均匀包裹,并且气孔较少。

关键词: 陶瓷结合剂, 金刚石砂轮, 微波烧结, 烧结温度, 力学性能, 微观组织

Abstract: In order to improve the performance of ceramic bonded diamond grinding wheels, microwave sintering technology was used, and the effects of microwave sintering temperature, ceramic bond content and diamond abrasive size on the performance of ceramic bonded diamond grinding wheels were analyzed through a series of experiments. The results show that microwave sintering temperature is the most important factor affecting the performance of ceramic bonded diamond grinding wheels, far exceeding the remaining two. The Rockwell hardness and bending strength of ceramic bonded diamond grinding wheel specimen reach great value at 740 ℃ and the porosity is small. The Rockwell hardness is 66 HRB, the bending strength is 76.5 MPa and the porosity is 17.8%. It is observed from the microstructure that the ceramic bonded diamond grinding wheels achieve the uniform encapsulation of diamond abrasive by ceramic bond at 740 ℃, and there are few pores.

Key words: ceramic bond, diamond grinding wheel, microwave sintering, sintering temperature, mechanical property, microstructure

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