Al2O3/Cu的界面微观结构及封接性能

硅酸盐通报 ›› 2022, Vol. 41 ›› Issue (1): 241-248.

所属专题：陶瓷

Al₂O₃/Cu的界面微观结构及封接性能

范彬彬^1,2, 赵林¹, 谢志鹏², 康丁华³, 刘溪海³

1.景德镇陶瓷大学材料科学与工程学院,景德镇 333403;
2.清华大学材料学院新型陶瓷与精细工艺国家重点实验室,北京 100084;
3.娄底市安地亚斯电子陶瓷有限公司,娄底 417000

收稿日期:2021-09-25 修订日期:2021-11-09 出版日期:2022-01-15 发布日期:2022-02-10
通信作者: 赵林,博士,副教授。E-mail:linzhaocn@126.com;谢志鹏,博士,教授。E-mail:xzp@mail.tsinghua.edu.cn
作者简介:范彬彬(1996—),男,硕士研究生。主要从事陶瓷与金属封接工艺及机理的研究。E-mail:1351217714@qq.com
基金资助:
国家自然科学基金(52072201,51962011)

Microstructure and Sealing Performance of Al₂O₃/Cu Brazed Joint

FAN Binbin^1,2, ZHAO Lin¹, XIE Zhipeng², KANG Dinghua³, LIU Xihai³

1. School of Materials Science and Engineering, Jingdezhen Ceramic University, Jingdezhen 333403, China;
2. State Key Lab of New Ceramics and Fine Processing, Department of Materials Science and Engineering, Tsinghua University, Beijing 100084, China;
3. Loudi City Andeans Electronic Ceramics Co. Ltd., Loudi 417000, China

Received:2021-09-25 Revised:2021-11-09 Online:2022-01-15 Published:2022-02-10

摘要/Abstract

摘要： 采用活化Mo-Mn法和活性金属钎焊(AMB)工艺对Al₂O₃陶瓷进行金属化处理,分别研究了两种金属化工艺的界面形貌、新相的形成及显微结构的演变,并测试了Al₂O₃/Cu的力学性能和气密性。研究表明:采用活化Mo-Mn法的封接界面处出现玻璃相的迁移,形成了立方相MnAl₂O₄,可以提高封接强度。AMB工艺中活性元素Ti与Al₂O₃反应依次形成厚度为0.64 μm的TiO和1.03 μm的Cu₃Ti₃O。各层间热膨胀系数(CTE)的差异给钎焊接头提供了良好的热弹性相容性且降低了残余应力。活化Mo-Mn法的封接强度((60.2±7.7) MPa)比AMB工艺((43.1±6.9) MPa)高,但在气密性方面两者并无明显差别(均在2.3×10^-11 Pa·m³·s^-1左右)。

关键词: 陶瓷-金属封接, Al₂O₃/Cu界面, 活化Mo-Mn法, AMB工艺, 金属化, 封接性能

Abstract: Al₂O₃ ceramics were metallized by the activated Mo-Mn method and the active metal brazing (AMB) process. The interfacial microstructure, formation mechanism of new phases and microstructure evolution of the brazed joints were investigated, and the mechanical properties and the He leakage rate of Al₂O₃/Cu specimen were tested. The results show that for activated Mo-Mn method, the formation of cubic phase MnAl₂O₄ is due to the migration of the glass phase at the brazing interface, which can improve the strength of the joint. During the AMB process, the active element Ti and Al₂O₃ form TiO and Cu₃Ti₃O layers, with a thickness of 0.64 μm and 1.03 μm, respectively.The difference of coefficient of thermal expansion (CTE) between layers provides good thermoelastic compatibility and reduces residual stress. The bonding strength of samples prepared by the activated Mo-Mn method ((60.2±7.7) MPa) is higher than that of samples prepared by the AMB process ((43.1±6.9) MPa) while the He leakage rates are similar (both around 2.3×10^-11 Pa·m³·s^-1).

Key words: ceramic-metal sealing, Al₂O₃/Cu interface, activated Mo-Mn method, AMB process, metallization, sealing performance

中图分类号:

TG454

范彬彬, 赵林, 谢志鹏, 康丁华, 刘溪海. Al₂O₃/Cu的界面微观结构及封接性能[J]. 硅酸盐通报, 2022, 41(1): 241-248.

FAN Binbin, ZHAO Lin, XIE Zhipeng, KANG Dinghua, LIU Xihai. Microstructure and Sealing Performance of Al₂O₃/Cu Brazed Joint[J]. BULLETIN OF THE CHINESE CERAMIC SOCIETY, 2022, 41(1): 241-248.

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Al₂O₃/Cu的界面微观结构及封接性能

Microstructure and Sealing Performance of Al₂O₃/Cu Brazed Joint

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