基于TGV的3D封装光纤微通道制备技术研究

doi:10.16552/j.cnki.issn1001-1625.2025.1094

摘要/Abstract

摘要：

为突破传统激光打孔等技术在玻璃基阵列通孔制备中存在的热损伤、孔形差、开孔密度低等局限，并满足光电子器件3D封装对高精度互联载体的需求，本文开展基于通孔玻璃（TGV）的3D封装光纤微通道制备研究。选用特种芯、皮玻璃光纤原料制备光纤预制棒，经拉丝、排棒排板、热压成型及酸蚀等工艺，制备光纤微通道阵列。研究表明，该技术热影响极小，通过工艺参数调控可将光纤单元的孔径偏差精准控制在±1 μm内，使光纤在酸蚀后可形成无锥度直通孔结构，有效提升了开孔密度与深径比一致性。该工艺为3D封装领域光电互联提供了兼具高精度与低成本解决方案，对推动光电子器件3D封装技术的集成化发展具有重要意义。

关键词: TGV, 3D封装, 光纤玻璃, 光纤微通道, 通孔阵列

Abstract:

To overcome the limitations of traditional laser drilling and other technologies in the preparation of glass-based array through-holes， such as thermal damage， poor hole shape， and low hole density， and to meet the demand for high-precision interconnection carriers in 3D packaging of optoelectronic devices， this paper investigates the preparation of 3D packaging optical fiber microchannels based on through glass via （TGV）. Special core and clad glass optical fiber raw materials were used to prepare optical fiber preforms， which were then processed through drawing， rod and plate arrangement， hot pressing， and acid etching to produce optical fiber microchannel arrays. Research indicates that this technology exhibits minimal thermal effects. By adjusting process parameters， the aperture deviation of fiber units can be precisely controlled within ±1 μm， enabling the formation of taper-free through hole structures in fibers after acid etching. This significantly enhances both via drilling density and aspect ratio consistency. This process offers a high-precision， low-cost solution for optoelectronic interconnects in 3D packaging， playing a significant role in advancing the integration of 3D packaging technology for optoelectronic devices.

Key words: TGV, 3D packaging, optical fiber glass, optical fiber microchannel, through-hole array

中图分类号:

TN43

马西响, 于长江, 李宁, 孙浩瑞, 王梓舟, 刘浩然, 明玥彤, 任宏宇, 王三昭. 基于TGV的3D封装光纤微通道制备技术研究[J]. 硅酸盐通报, 2026, 45(3): 1031-1037.

MA Xixiang, YU Changjiang, LI Ning, SUN Haorui, WANG Zizhou, LIU Haoran, MING Yuetong, REN Hongyu, WANG Sanzhao. 3D Packaging Optical Fiber Microchannels Preparation Technology Based on TGV[J]. BULLETIN OF THE CHINESE CERAMIC SOCIETY, 2026, 45(3): 1031-1037.

图/表 10

图1 面酸蚀质量与时间的关系曲线

Fig.1 Relationship curve of corrosion mass and time for surface acid etching

图2 光纤微通道的制备流程

Fig.2 Flowchart of optical fiber microchannels fabrication

图3 光纤拉制过程示意图

Fig.3 Schematic diagram of optical fiber drawing process

图4 拉丝炉内部结构示意图

Fig.4 Schematic diagram of internal structure of drawing furnace

图5 光纤排棒及排板照片

Fig.5 Photos of optical fiber rod and plate arrangement

图6 热压压力工艺曲线

Fig.6 Hot pressing pressure process curves

图7 二次退火工艺曲线

Fig.7 Secondary annealing process curve

图8 4英寸3D封装用光纤坯板宏观照片

Fig.8 Macroscopic photo of 4-inch 3D packaging optical fiber slab

图9 微通道阵列SEM照片

Fig.9 SEM image of microchannel array

图10 微通道内壁的SEM照片

Fig.10 SEM image of microchannel inner wall

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