Application and Performance Requirements of Glass Substrates in Chip Packaging

doi:10.16552/j.cnki.issn1001-1625.2024.0916

Abstract

Abstract: Glass substrates are set to become a critical material in advanced packaging technologies due to their superior high-frequency electrical properties, thermal stability, and chemical durability.This paper examines the roles and advantages of glass substrates in the packaging process, highlighting their applications in intermediary layers, fan-out packaging, micro-electro-mechanical system packaging, and integrated antenna packaging. This paper also summarizes the common composition and key physicochemical properties of glass substrates used in chip packaging, and provides insights into their future development.

Key words: glass substrate, chip packaging, through glass via, borosilicate glass, aluminum-silicon glass, alkali-free glass

CLC Number:

TQ171.73

ZHANG Xingzhi, TIAN Yingliang, ZHAO Zhiyong, ZHANG Xun, WANG Ruzhi. Application and Performance Requirements of Glass Substrates in Chip Packaging[J]. BULLETIN OF THE CHINESE CERAMIC SOCIETY, 2025, 44(2): 707-716.

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