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BULLETIN OF THE CHINESE CERAMIC SOCIETY ›› 2023, Vol. 42 ›› Issue (11): 4113-4121.

Special Issue: 陶瓷

• Ceramics • Previous Articles     Next Articles

Preparation of Morphology-Controlled Gold Powder and Its Influence on Properties of Conductor Paste for LTCC

NA Hua, HAI Yun, HAN Bin, GUO Enxia, LYU Jinyu, XU Bo, ZU Chengkui   

  1. China Building Material Academy Co., Ltd., Beijing 100024, China
  • Received:2023-06-29 Revised:2023-08-23 Online:2023-11-15 Published:2023-11-22

Abstract: Gold conductor slurry is widely used in low-temperature co-fired ceramics (LTCC) because of the good stability and weldability. The surface morphology, particle size of gold powder have great impact on the gold conductor paste. With chlorinic acid as the raw material, D-isoreascorbic acid as the reducing agent and acacia senegal as the dispersant, three kinds of spherical gold powder with high purity were prepared by different experimental conditions, and their surface morphology, particle size and specific surface area were all different. The growth process of gold powder belongs to the seed-mediated growth method, and controlling the Cl- concentration and the pH value of the reaction solution can finally obtain different morphology and particle size. The results show that the specific surface area of three kinds of gold powder are 0.740, 0.418 and 0.447 m2·g-1, respectively. The specific surface area of gold powder significantly affects the viscosity of gold paste. Gold conductor paste for LTCC with the viscosity of 326, 209 and 214 Pa·s are prepared in the same ratio with the three kinds of gold powder as the function phase, respectively. The experimental results show that the gold conductor slurry is prepared from the gold powder made when dissolving chloruric acid in NaOH solution and adjusting the pH value to 2, as well as the setting 30%(mass fraction) diethylene glycol ether solution as agent solvent, which has the highest density, low square resistance and the highest gold wire bond strength. The square resistance and gold wire bond strength are 1.11 mΩ/□ and 8.66 g, respectively. The weldability of all the three kinds of gold conductor paste are better.

Key words: low temperature co-fired ceramics, gold powder morphology, specific surface area, gold conductor paste, membrane layer density, gold wire bond strength

CLC Number: