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BULLETIN OF THE CHINESE CERAMIC SOCIETY ›› 2022, Vol. 41 ›› Issue (9): 3259-3271.

• Ceramics • Previous Articles     Next Articles

Research Progress on Oxygen Control Technology During Preparation of Czochralski Single-Crystal Silicon

ZHANG Mengyu1,2, LI Tai1,2, DU Shanlin1,2, HUANG Zhenling1,2, ZHAO Liang1,2, LYU Guoqiang1,2, MA Wenhui1,2   

  1. 1.School of Metallurgy and Energy Engineering, Kunming University of Science and Technology, Kunming 650093, China;
    2.Yunnan Silicon Industry Engineering Research Center, Kunming 650093, China
  • Received:2022-04-22 Revised:2022-06-14 Online:2022-09-15 Published:2022-09-27

Abstract: The single-crystal silicon prepared by Czochralski (CZ) method is showing a development trend toward larger size, higher quality, and lower cost with the rapidly development of China's photovoltaic industry. Nevertheless, the issue of high oxygen impurity content in single-crystal silicon is increasingly drawing attention as the size of the single-crystal silicon size increases. In this paper, based on the introduction of oxygen impurity transport mechanism during the process of preparing single-crystal silicon by CZ method, the current state of oxygen control technology in the production of single-crystal silicon was summarized. Furthermore, the influence laws of thermal field structure optimization, process optimization, doping elements, argon flow field optimization and new CZ technology on the oxygen impurity content of single-crystal silicon were analyzed, and the development direction of oxygen control technology in the future was put forward.

Key words: Czochralski method, single-crystal silicon, oxygen control technology, thermal field structure, process parameter, continuous Czochralski method

CLC Number: