Surface Modification of Si3N4 Powder and Its Effect on Digital Light Processing

Abstract

Abstract: Traditional ceramic processing technology has high cost, long cycle and many defects, which makes it difficult to produce high-performance ceramics. The refractive index (n=2.1) of pure Si₃N₄ powder is quite different from that of resin (n=1.49), and the light scattering is serious, which leads to the lower curing depth of the ceramic paste. It is difficult to directly use stereolithography technology to form Si₃N₄ ceramic parts. In order to solve the problem that Si₃N₄ powder is difficult to be cured, two methods of surface coating and surface oxidation were used to modify Si₃N₄ powder, and the influence of the two methods on the light curing characteristics of Si₃N₄ powder was compared. The results show that the organic monomer uniformly attaches to the surface of Si₃N₄ powder after a certain reaction time; after being oxidized at 800 ℃ for 4 h, amorphous SiO₂ layer is formed on the surface of Si₃N₄ powder, which is uniformly attached to the surface of Si₃N₄ powder. The curing depth of original Si₃N₄ powder is merely 20 μm, and the curing depth of Si₃N₄ powder after coating modification and oxidation modification increase to 40 μm and 50 μm, respectively. Both methods effectively improve the curing depth of original Si₃N₄ powder.

Key words: digital light processing, silicon nitride, surface modification, coating, surface oxidation, curing depth

CLC Number:

TQ174

CHEN Rufei, DUAN Wenyan, WANG Gong, LIU Bingshan, LIU Xiaodong, LI Xin. Surface Modification of Si₃N₄ Powder and Its Effect on Digital Light Processing[J]. BULLETIN OF THE CHINESE CERAMIC SOCIETY, 2021, 40(6): 1957-1964.

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Surface Modification of Si₃N₄ Powder and Its Effect on Digital Light Processing

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