玻璃基板在芯片封装中的应用和性能要求
张兴治, 田英良, 赵志永, 张迅, 王如志
Application and Performance Requirements of Glass Substrates in Chip Packaging
ZHANG Xingzhi, TIAN Yingliang, ZHAO Zhiyong, ZHANG Xun, WANG Ruzhi
硅酸盐通报
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2025, (2): 707
-716
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DOI: 10.16552/j.cnki.issn1001-1625.2024.0916
