形貌可控金粉的制备及其对LTCC导体浆料性能的影响

摘要/Abstract

摘要： 金导体浆料因具有较好的稳定性与可焊性而被广泛应用于低温共烧陶瓷(LTCC)中。金粉的表面形貌、粒径等性质会对金导体浆料产生较大影响。以氯金酸为原料、D-异抗坏血酸为还原剂、阿拉伯树胶为分散剂,采用不同试验条件制备了纯度较高的三种类球形金粉,且三种金粉的表面形貌、粒径与比表面积均不同。金粉生长过程属于种子介导的生长方法,控制Cl^-浓度与反应液pH值最终可获得不同形貌与粒径的金粉。研究表明,三种金粉的比表面积分别为0.740、0.418、0.447 m²·g^-1。金粉比表面积显著影响金浆的黏度,以三种金粉为功能相,在相同配比下制备LTCC用金导体浆料,其黏度分别为326、209及214 Pa·s。试验结果表明,以NaOH溶液溶解氯金酸并调整氯金酸溶液pH值为2,30%(质量分数)二乙二醇乙醚溶液作还原剂溶剂时制得的金粉为功能相来制备金导体浆料,烧结后膜层致密度最高、方阻较低以及金丝键合强度最高,其方阻与金丝键合强度分别为1.11 mΩ/□与8.66 g,三种金导体浆料均具有较好的可焊性。

关键词: 低温共烧陶瓷, 金粉形貌, 比表面积, 金导体浆料, 膜层致密度, 金丝键合强度

Abstract: Gold conductor slurry is widely used in low-temperature co-fired ceramics (LTCC) because of the good stability and weldability. The surface morphology, particle size of gold powder have great impact on the gold conductor paste. With chlorinic acid as the raw material, D-isoreascorbic acid as the reducing agent and acacia senegal as the dispersant, three kinds of spherical gold powder with high purity were prepared by different experimental conditions, and their surface morphology, particle size and specific surface area were all different. The growth process of gold powder belongs to the seed-mediated growth method, and controlling the Cl^- concentration and the pH value of the reaction solution can finally obtain different morphology and particle size. The results show that the specific surface area of three kinds of gold powder are 0.740, 0.418 and 0.447 m²·g^-1, respectively. The specific surface area of gold powder significantly affects the viscosity of gold paste. Gold conductor paste for LTCC with the viscosity of 326, 209 and 214 Pa·s are prepared in the same ratio with the three kinds of gold powder as the function phase, respectively. The experimental results show that the gold conductor slurry is prepared from the gold powder made when dissolving chloruric acid in NaOH solution and adjusting the pH value to 2, as well as the setting 30%(mass fraction) diethylene glycol ether solution as agent solvent, which has the highest density, low square resistance and the highest gold wire bond strength. The square resistance and gold wire bond strength are 1.11 mΩ/□ and 8.66 g, respectively. The weldability of all the three kinds of gold conductor paste are better.

Key words: low temperature co-fired ceramics, gold powder morphology, specific surface area, gold conductor paste, membrane layer density, gold wire bond strength

中图分类号:

TQ174

那华, 海韵, 韩滨, 郭恩霞, 吕金玉, 徐博, 祖成奎. 形貌可控金粉的制备及其对LTCC导体浆料性能的影响[J]. 硅酸盐通报, 2023, 42(11): 4113-4121.

NA Hua, HAI Yun, HAN Bin, GUO Enxia, LYU Jinyu, XU Bo, ZU Chengkui. Preparation of Morphology-Controlled Gold Powder and Its Influence on Properties of Conductor Paste for LTCC[J]. BULLETIN OF THE CHINESE CERAMIC SOCIETY, 2023, 42(11): 4113-4121.

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