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硅酸盐通报 ›› 2001, Vol. 20 ›› Issue (2): 48-50.

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变密宽Cu-W梯度材料的烧结致密化

姜洪义;沈强;张联盟   

  1. 武汉工业大学;武汉工业大学材料复合新技术国家实验室,武汉 430070
  • 出版日期:2001-04-15 发布日期:2021-01-15

Densification of Cu-W System Materials with Graded Density

Jiang Hongyi;Shen Qiang;Zhang Lianmeng   

  • Online:2001-04-15 Published:2021-01-15

摘要: 本论文采用热压烧结方法,选择Zn作为烧结助剂,进行了不同W含量的Cu-W烧结体的低温致密化研究。各烧结体在相同的烧结工艺条件下(1123K,20MPa,1h)相对密度均达到97%以上。在此基础上,成功地制备出了整体致密的Cu-W体系梯度材料,其W含量沿厚度方向在0~25%(质量分数)范围内变化。

关键词: Cu-W;梯度材料;热压烧结

Abstract: The densification of Cu-W with different W-content at relatively low temperature was studied with the sintering activitor of Zn by hot-press sintering process. The relative density of all sintered compacts is above 97.0% at the same condition(1123K,20MPa,1h).Cu-W system FGM was successfully fabricated.Along the direction of thickness, the content of W changes from 0 to 25wt%

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